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(CityRegions.Com, January 25, 2019 ) Global Semiconductor Packaging Materials Market Research Report 2019 :
Semiconductor packages are plastic, ceramic, and metal components that are not only protect fabricated integrated circuits (ICs) on the semiconductor die, but also act as an interconnect between the printed circuit board (PCB) and the die during shipping and handling. These packaging materials safeguard and protect the die from the external mechanical impacts and corrosion, besides acting as an electrically conductive interconnection with excellent signal propagation properties.
The demand for organic substrates semiconductor packaging materials is increasing because the semiconductor packaging industry is advancing towards leadless and cable-less packaging materials. These substrates are replacing the application of lead frames and bonding wires. These substrates are flexible and can also be used as interconnects. Our research analysts have estimated that the IC packaging materials market will witness considerable growth in the organic substrates segment throughout the projected period.
Countries such as Taiwan, China, Japan, and South Korea are the major contributors to the growth of the semiconductor packaging materials market in APAC. The adoption of integrated circuit packaging and semiconductor packaging is increasing in this region due to the growing adoption of consumer electronic goods and smart mobile devices. The focus of the international corporations towards expanding their manufacturing operations in countries such as China, due to the availability of cheap labor, raw materials, and favorable factors of production, will also drive the market’s growth prospects in this region.
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The following manufacturers are covered in this report, with sales, revenue, market share for each Amkor Technology
DuPont
BASF
Henkel
Honeywell
Kyocera
Toppan Printing
Hitachi Chemical
ASM Pacific Technology
Beijing Kehua New Chemical Technology
Market size by Product
Organic Substrates
Lead Frames
Bonding Wires
Other
Market size by End User
IDM (Integrated Device Manufacturers)
OSAT (Outsourced Semiconductor Assembly and Test Companies)
Browse complete report here: https://www.orbisresearch.com/reports/index/global-semiconductor-packaging-materials-market-insights-forecast-to-2025
Table Of Contents:
Chapter One: Study Coverage
1.1 Semiconductor Packaging Materials Product
1.2 Key Market Segments in This Study
1.3 Key Manufacturers Covered
1.4 Market by Type
1.4.1 Global Semiconductor Packaging Materials Market Size Growth Rate by Type
1.4.2 Organic Substrates
1.4.3 Lead Frames
1.4.4 Bonding Wires
1.4.5 Other
1.5 Market by Application
1.5.1 Global Semiconductor Packaging Materials Market Size Growth Rate by Application
1.5.2 IDM (Integrated Device Manufacturers)
1.5.3 OSAT (Outsourced Semiconductor Assembly and Test Companies)
1.6 Study Objectives
1.7 Years Considered
Chapter Two: Executive Summary
2.1 Global Semiconductor Packaging Materials Production
2.1.1 Global Semiconductor Packaging Materials Revenue 2014-2025
2.1.2 Global Semiconductor Packaging Materials Production 2014-2025
2.1.3 Global Semiconductor Packaging Materials Capacity 2014-2025
2.1.4 Global Semiconductor Packaging Materials Marketing Pricing and Trends
2.2 Semiconductor Packaging Materials Growth Rate (CAGR) 2019-2025
2.3 Analysis of Competitive Landscape
2.3.1 Manufacturers Market Concentration Ratio (CRChapter Five: and HHI)
2.3.2 Key Semiconductor Packaging Materials Manufacturers
2.4 Market Drivers, Trends and Issues
Continued….
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+1 (214) 884-6817
sales@orbisresearch.com
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