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(CityRegions.Com, August 29, 2018 ) 3D IC is a single chip in which all components onthe layers communicate using on-chip signaling, whethervertically or horizontally.
There are four ways to built 3D ICs :- 1. Monolithic 2. Wafer on wafer 3. Die on wafer 4. Die on die
3D integration can reduce the wiring, thereby reducing the capacitances, power dissipation and chip area improves performance.
Over the next five years, Publisher projects that 3D Ics will register a 15.9% CAGR in terms of revenue, reach US$ 7340 million by 2023, from US$ 3030 million in 2017.
This report presents a comprehensive overview, market shares, and growth opportunities of 3D Ics market by product type, application, key manufacturers and key regions.
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To calculate the market size, Publisher considers value and volume generated from the sales of the following segments:
Segmentation by product type:
Beam re-crystallization
Wafer bonding
Silicon epitaxial growth
Solid phase crystallization
Segmentation by application:
Consumer electronics
Information and communication technology
Transport (automotive and aerospace)
Military
Others(Biomedical applications and R&D)
Browse Complete Report@ http://www.orbisresearch.com/reports/index/2018-2023-global-3d-ics-consumption-market-report
The report also presents the market competition landscape and a corresponding detailed analysis of the major vendor/manufacturers in the market. The key manufacturers covered in this report:
XILINX
Taiwan Semiconductor Manufacturing Company
The 3M Company
Tezzaron Semiconductor Corporation
STATS ChipPAC
Ziptronix
United Microelectronics Corporation
MonolithIC 3D
Elpida Memory
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Some Points From Table of Content:
1 Scope of the Report
2 Executive Summary
3 Global 3D Ics by Players
4 3D Ics by Regions
5 Americas
6 APAC
7 Europe
Continued…
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Hector Costello
+1 (214) 884-6817
sales@orbisresearch.com
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