|
|
Home | Submit Press Release | Advertise | Submit Website
(CityRegions.Com, January 01, 2019 ) In this report, LP Information studies the present scenario (with the base year being 2017) and the growth prospects of global System in Package Technology market for 2018-2023.
SiP is a packaging technology, which contains multiple die in a single module. It is a mixture of various integrated circuits in a compact size, which further reduces the cost to develop and assemble a printed circuit board (PCB). SiP dies can be stacked vertically or tiled horizontally with standard off-chip wire bonds or solder bumps.
Over the next five years, LPI(LP Information) projects that System in Package (SiP) Technology will register a xx% CAGR in terms of revenue, reach US$ xx million by 2023, from US$ xx million in 2017.
This report presents a comprehensive overview, market shares and growth opportunities of System in Package (SiP) Technology market by product type, application, key companies and key regions.
Ask for a sample copy of this report: https://www.orbisresearch.com/contacts/request-sample/2346535
The key players covered in this report:
Amkor Technology
Fujitsu
Toshiba Corporation
Qualcomm Incorporated
Renesas Electronics Corporation
Samsung Electronics
Jiangsu Changjiang Electronics Technology
ChipMOS Technologies
Powertech Technologies
ASE Group
Segmentation by product type:
2-D IC Packaging
2.5-D IC Packaging
Segmentation by application:
Consumer Electronics
Automotive
Telecommunication
Industrial System
Aerospace & Defense
Others (Traction & Medical)
Have a query? Please click here: https://www.orbisresearch.com/contacts/enquiry-before-buying/2346535
Some TOC Points:
1 Scope of the Report
1 Scope of the Report
1.1 Market Introduction
1.2 Research Objectives
1.3 Years Considered
1.4 Market Research Methodology
1.5 Economic Indicators
1.6 Currency Considered
2 Executive Summary
2 Executive Summary
2.1 World Market Overview
2.1.1 Global System in Package (SiP) Technology Market Size 2013-2023
2.1.2 System in Package (SiP) Technology Market Size CAGR by Region
2.2 System in Package (SiP) Technology Segment by Type
2.2.1 2-D IC Packaging
2.2.2 2.5-D IC Packaging
2.2.3 3-D IC Packaging
2.3 System in Package (SiP) Technology Market Size by Type
2.3.1 Global System in Package (SiP) Technology Market Size Market Share by Type (2013-2018)
2.3.2 Global System in Package (SiP) Technology Market Size Growth Rate by Type (2013-2018)
2.4 System in Package (SiP) Technology Segment by Application
2.4.1 Consumer Electronics
2.4.2 Automotive
2.4.3 Telecommunication
2.4.4 Industrial System
2.4.5 Aerospace & Defense
2.4.6 Others (Traction & Medical)
2.5 System in Package (SiP) Technology Market Size by Application
2.5.1 Global System in Package (SiP) Technology Market Size Market Share by Application (2013-2018)
2.5.2 Global System in Package (SiP) Technology Market Size Growth Rate by Application (2013-2018)….. &Continued
About Us:
Orbis Research (orbisresearch.com) is a single point aid for all your market research requirements. We have vast database of reports from the leading publishers and authors across the globe. We specialize in delivering customized reports as per the requirements of our clients. We have complete information about our publishers and hence are sure about the accuracy of the industries and verticals of their specialization. This helps our clients to map their needs and we produce the perfect required market research study for our clients.
Contact Us:
Hector Costello
Senior Manager – Client Engagements
4144N Central Expressway,
Suite 600, Dallas,
Texas - 75204, U.S.A.
Phone No.: +1 (214) 884-6817; +912064101019
Email id: sales@orbisresearch.com
Orbis Research
Hector Costello
+1 (214) 884-6817
sales@orbisresearch.com
Source: EmailWire.Com 
Source: EmailWire.com
|
|
