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(CityRegions.Com, August 16, 2018 ) Multilayer PCB is made up of three or more conductive layers(copper foil layer), these layers are pressed together and form multilayer PCB. Copper foil layer is bonded together by PP(prepreg), Multilayer PCB is one of the most complex types in printed circuit board.
Most PCB manufacturers are finding the demand for multilayer boards increasing by leaps and bounds. This growing demand is fed by the need for smaller, lighter boards for use in electrical devices, military equipment, healthcare miniaturization, and an expanding market for smart devices incorporated in home automation systems.
Smartphones and computers are perfect applications for multilayer PCBs with their need for compactness and light weight, yet sophisticated functionality.
Within the PCB market, the communication industry is expected to remain the largest market. Continuous innovations in smartphones and increasing demand from emerging economies are expected to spur growth for this segment over the forecast period.
Over the next five years, LPI(LP Information) projects that Multilayer Printed Circuit Board (Multilayer Printed-wiring Board) will register a 1.9% CAGR in terms of revenue, reach US$ 25700 million by 2023, from US$ 23000 million in 2017.
This report presents a comprehensive overview, market shares, and growth opportunities of Multilayer Printed Circuit Board (Multilayer Printed-wiring Board) market by product type, application, key manufacturers and key regions.
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To calculate the market size, LP Information considers value and volume generated from the sales of the following segments:
Segmentation by product type:
Layer 4-6
Layer 8-10
Layer 10+
Segmentation by application:
Consumer Electronics
Communications
Computer Related Industry
Automotive Industry
Other
Browse the complete report @ http://www.orbisresearch.com/reports/index/2018-2023-global-multilayer-printed-circuit-board-multilayer-printed-wiring-board-consumption-market-report
The report also presents the market competition landscape and a corresponding detailed analysis of the major vendor/manufacturers in the market. The key manufacturers covered in this report:
Nippon Mektron
ZD Tech
TTM Technologies
Unimicron
Sumitomo Denko
Compeq
Tripod
Samsung E-M
Young Poong Group
HannStar
Ibiden
Nanya PCB
KBC PCB Group
Daeduck Group
AT&S
Fujikura
Meiko
Multek
Kinsus
Chin Poon
T.P.T.
Shinko Denski
Wus Group
Simmtech
Mflex
CMK
LG Innotek
Gold Circuit
Shennan Circuit
Ellington
Kinwong
Founder Tech
Dynamic
Aoshikang
Wuzhou
CCTC
SZ Fast Print
Guangdong Xinda
Shenzhen Suntak
Redboard
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Some Point from TOC:
1 Scope of the Report
2 Executive Summary
3 Global Multilayer Printed Circuit Board by Players
4 Multilayer Printed Circuit Board by Regions
5 Americas
6 APAC
7 Europe
8 Middle East & Africa
9 Market Drivers, Challenges and Trends
….Continued
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Hector Costello
+1 (214) 884-6817
sales@orbisresearch.com
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